육안 검사 자동화 기술

자동 육안 검사 장치는 공학기술, 전기-전자기술, 기계기술의 3가지와 소프트 기술이 밀접하게 연관되어 구성되어 있다. 본서에서는 결함을 검출하는 센싱 기술, 검사를 위한 데이터 처리 알고리즘, 실용적인 신호처리 하드웨어 등에 중점을 두고 구성은 크게 2파트로 육안 검사 자동화를 위한 요소 기술과 육안 검사 자동화의 실용 기술로 꾸며 보았다. 저자는 이 책에 육안 검사를 자동화 하는데 필요한 지식을 먼저 생각해 볼 수 있도록 하였으며 이러한 지식을 바탕으로 실제적으로 육안 검사 자동화 시스템을 구성해 볼 수 있도록 함으로써 이론과 실용을 강조하였다.

제 Ⅰ 단원 육안 검사 자동화를 위한 요소 기술 제 1장 육안 검사 자동화의 개요 ·································································· 13 1.1 측정과 검사의 구별 ······················································································· 15 1.1.1 측정의 문제 ···························································································· 15 1.1.2 계측과 측정의 차이 ·············································································· 16 1.1.3 측정과 검사의 차이 ·············································································· 17 1.2 비파괴 검사의 개요 ······················································································ 18 1.2.1 비파괴 검사의 정의 ·············································································· 18 1.2.2 비파괴 검사의 원리 ············································································· 18 1.2.3 비파괴 검사의 종류와 특징 ································································ 18 1.3 검사의 목적과 동향 ······················································································ 22 1.3.1 검사의 목적 ··························································································· 22 1.3.2 검사의 동향 ·························································································· 24 1.4 육안 검사 시스템의 사례 ············································································ 25 1.4.1 전기전자 산업에의 응용 ······································································ 25 1.4.2 자동 제조 산업에의 응용 ···································································· 27 1.4.3 고밀도 실장 회로판 제조 공정에의 응용 ········································· 29 1.4.4 비전 검사 ······························································································ 35 1.5 검사의 문제점 ······························································································· 37 1.5.1 검사 기술의 문제점 ············································································· 37 1.5.2 검사의 자동화를 위한 문제점 ···························································· 38 1.6 육안 검사와 자동화 ······················································································ 39 1.6.1 서론 ········································································································ 39 1.6.2 자동화의 순서 ······················································································· 41 제 2장 광학 기술의 개요 ·············································································· 45 2.1 광학의 개요 ··································································································· 47 2.1.1 광의 편광 ······························································································· 47 2.1.2 굴절과 반사 ·························································································· 50 2.1.3 빛의 산란 ······························································································ 56 2.1.4 빛의 회절 ······························································································ 57 2.2 광원의 개요 ··································································································· 62 2.2.1 백색 광원 ······························································································ 62 2.2.2 레이저 다이오드 ·················································································· 62 2.2.3 발광 다이오드 ····················································································· 80 2.3 광센서의 개요 ······························································································· 85 2.3.1 광전 현상 ······························································································ 85 2.3.2 광전 소자의 특성표시법 ····································································· 93 2.3.3 광센서 ··································································································· 95 2.4 조도 ·············································································································· 113 2.5 조명계 ··········································································································· 115 제 3장 신호처리와 변환 기술의 개요 ························································ 117 3.1 전기회로 소자 ······························································································ 119 3.1.1 저항기 ··································································································· 119 3.1.2 콘덴서 ·································································································· 122 3.1.3 인덕터 ·································································································· 125 3.2 전자회로 소자 ····························································································· 130 3.2.1 진성반도체의 성질 ·············································································· 131 3.2.2 n형 반도체와 p형 반도체 ································································ 132 3.2.3 다이오드 ······························································································ 133 3.2.4 트랜지스터 ·························································································· 136 3.3 전기전자 회로의 개요 ················································································ 144 3.3.1 다이오드 회로 ····················································································· 144 3.3.2 트랜지스터 회로 ················································································ 154 3.3.3 연산 증폭 회로 ·················································································· 163 3.4 신호 변환의 개요 ······················································································· 167 3.4.1 기본적인 입력 회로 ··········································································· 167 3.4.2 매칭 회로 ··························································································· 180 3.4.3 신호의 증폭 ························································································ 184 3.4.4 파형 변환 ···························································································· 187 3.4.5 논리 회로 ··························································································· 200 3.4.6 연산 회로 ··························································································· 209 3.4.7 샘플링과 양자화 ················································································ 220 제 Ⅱ 단원 육안 검사 자동화의 실용 기술 제 4장 외관 결함의 센싱 ············································································ 229 4.1 외관 결함과 광학 정보 관계 ····································································· 231 4.2 표면 오염 ···································································································· 232 4.3 표면흠집, 표면 거칠함, 먼지 부착 ························································· 234 4.4 요철 ············································································································· 238 4.5 윤곽 ·············································································································· 241 4.6 투명체 ·········································································································· 244 4.7 용기의 누설 ································································································ 246 4.8 둘레 전체의 검사 ······················································································· 247 제 5장 광센서의 이용법 ·············································································· 249 5.1 점 센서의 이용법 ························································································ 251 5.1.1 일반사항 ······························································································· 251 5.1.2 광전자증배관 ······················································································ 254 5.1.3 포토다이오드 ······················································································ 256 5.2 라인 센서의 이용법 ··················································································· 258 5.3 면 센서의 이용법 ······················································································· 261 5.4 플라잉스폿 시스템 ····················································································· 264 5.5 플라잉이미지 시스템 ················································································· 267 5.6 밀착형 이미지센서 ····················································································· 268 5.7 결상 광학계 ································································································ 269 5.8 화상의 떨림 방지 ······················································································· 271 제 6장 검사의 알고리즘 ·············································································· 275 6.1 비교기준 데이터의 표현법 ········································································ 277 6.1.1 피측정물 내부에서의 비교 ································································ 277 6.1.2 창성된 정상 패턴과의 비교 ····························································· 280 6.1.3 형상 특성치와의 비교 ······································································· 283 6.1.4 결함 국소 패턴의 유무 판정 ··························································· 286 6.1.5 실물과의 비교 ···················································································· 288 6.1.6 설계 데이터와의 비교 ······································································ 290 6.1.7 메모리상의 화상 데이터와의 비교 ··················································· 291 6.2 화상 데이터의 절감법 ··············································································· 292 6.2.1 정점 샘플링 ······················································································ 292 6.2.2 라인 ····································································································· 293 6.2.3 윈도우 ································································································· 295 6.2.4 마스킹(masking) ··············································································· 296 6.2.5 화상 데이터의 차원 압축 ································································ 296 6.3 비교 연산 ···································································································· 299 6.4 위치의 보정 ································································································ 301 6.5 판정 기준 데이터의 설정법 ····································································· 303 제 7장 신호 레벨 해석에 의한 결함 검출 ··············································· 305 7.1 개요 ·············································································································· 307 7.2 신호의 보정 ································································································ 308 7.3 결함부의 강조 ······························································································ 311 7.4 임계값 회로 ································································································· 312 7.5 검사 영역의 절단 ······················································································· 314 제 8장 2차원 화상 처리에 의한 결함 검출 ·············································· 319 8.1 개요 ·············································································································· 321 8.2 2치화와 화소의 분리 ················································································· 323 8.3 파이프라인 처리 회로 ··············································································· 325 8.4 국소 병렬 연산의 응용 예 ······································································· 329 8.5 PC의 이용 ··································································································· 332 제 9장 검사 장치의 구성 ············································································ 333 9.1 점 센서에 의한 형상 검사 장치 ······························································ 335 9.2 라인 센서에 의한 표면 결함 검사 장치 ················································· 338 9.3 영상 카메라를 이용한 윈도우 회로 ························································· 341 제 10장 성능의 검토 ··················································································· 343 10.1 개요 ············································································································ 345 10.2 정도 ············································································································ 345 10.3 분해능 ········································································································ 347 10.3.1 샘플링 정리 ······················································································ 347 10.3.2 촬상소자와 분해능 ·········································································· 349 10.3.3 Laser 주사와 분해능 ····································································· 350 10.3.4 렌즈의 해상력 ·················································································· 352 10.3.5 증폭회로와 분해능 ·········································································· 352 10.3.6 위치결정 정도의 영향 ···································································· 353 10.3.7 분해능의 향상 ·················································································· 354 10.4 검사 속도 ·································································································· 355 10.5 재현성 ········································································································ 356 10.6 그 밖의 평가 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